Interconnect Lifetime Prediction for Reliability-Aware Systems

Interconnect Lifetime Prediction for Temperature - Aware Design

Thermal effects are becoming a limiting factor in high-performance circuit design due to the strong temperature-dependence of leakage power, circuit performance, IC package cost and reliability. Temperature-aware design tries to maximize performance under a given thermal envelope through various static and dynamic approaches. While existing interconnect reliability models assume a constant temp...

Interconnect Lifetime Prediction with Temporal and Spatial Temperature Gradients for Reliability-Aware Design and Runtime Management: Modeling and Applications

Thermal effects are becoming a limiting factor in high performance circuit design due to the strong temperature dependence of leakage power, circuit performance, IC package cost and reliability. While many interconnect reliability models assume a constant temperature, this paper analyzes the effects of temporal and spatial thermal gradients on interconnect lifetime in terms of electromigration....

An Evaluation of the Systems Reliability Using Fuzzy Lifetime Distribution

A Survey of Lifetime Reliability-Aware System-Level Design Techniques for Embedded Multiprocessor Systems

Lifetime reliability is emerging as a major concern for system design as escalating power density and hence temperature variation continues to accelerate wear-out, leading to a growing prominence of device-defects. This has attracted a significant attention both in industry and in academia to investigate on wear-out mitigation techniques, from micro-architectural adaptations to systemlevel opti...

Temperature-Aware Modeling and Banking of IC Lifetime Reliability

Most existing integrated circuit (IC) reliability models assume a uniform, typically worst-case, operating temperature, but temporal and spatial temperature variations affect expected device lifetime. As a result, design decisions and dynamic thermal management (DTM) techniques using worst-case models are pessimistic and result in excessive design margins and unnecessary runtime engagement of c...